Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2020
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.4047414